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Title:
THERMALLY CONDUCTIVE REINFORCING SHEET, MOLDED ARTICLE AND REINFORCING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2012/002076
Kind Code:
A1
Abstract:
A thermally conductive reinforcing sheet provided with a reinforcing layer is bonded to an aluminum sheet having a thickness of 1.0mm, and heated for 10 minutes at 80°C. The resulting sheet has a flexural strength of 10N or greater at a displacement of 1mm, and the thermal conductivity of the reinforcing layer is 0.25W/(m·K) or greater.

Inventors:
MASE TAKUYA (JP)
TERADA YOSHIO (JP)
TOJO MIDORI (JP)
Application Number:
PCT/JP2011/061938
Publication Date:
January 05, 2012
Filing Date:
May 25, 2011
Export Citation:
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Assignee:
NITTO DENKO CORP (JP)
MASE TAKUYA (JP)
TERADA YOSHIO (JP)
TOJO MIDORI (JP)
International Classes:
C08J5/18; B32B7/02; C08L9/00; C08L15/00; C09J7/10
Foreign References:
JP2008150479A2008-07-03
JP2001310974A2001-11-06
JP2002284996A2002-10-03
JP2003273296A2003-09-26
Attorney, Agent or Firm:
OKAMOTO, HIROYUKI (JP)
Hiroyuki Okamoto (JP)
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Claims:



 
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