Title:
THERMALLY CONDUCTIVE RESIN COMPOSITION, CURED OBJECT OBTAINED THEREFROM, AND THERMALLY CONDUCTIVE SHEET AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2022/201513
Kind Code:
A1
Abstract:
A thermally conductive resin composition which comprises a polycarbonate polyol compound (A), a polyisocyanate compound (B), and a spherical alumina filler (C) and which may further contain a plasticizer (D). The polycarbonate polyol compound (A) has a hydroxyl equivalent of 200-800 g/eq. The equivalent ratio of isocyanate groups contained in the polyisocyanate compound (B) to hydroxyl groups contained in the polycarbonate polyol compound (A), (isocyanate groups)/(hydroxyl groups), is 0.26-0.40. The content of the spherical alumina filler (C) and the content of the plasticizer (D) are 400-900 parts by mass and 30 parts by mass or less, respectively, per 100 parts by mass of the sum of the polycarbonate polyol compound (A), the polyisocyanate compound (B), and the plasticizer (D).
Inventors:
NAKATANI KOJI (JP)
Application Number:
PCT/JP2021/012940
Publication Date:
September 29, 2022
Filing Date:
March 26, 2021
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
C08G18/08; C08G18/44; C08J5/18; C08K3/22; C08K7/18; C08L75/04; C09K5/14
Domestic Patent References:
| WO2020240703A1 | 2020-12-03 |
Foreign References:
| JP2019172935A | 2019-10-10 | |||
| JPH111675A | 1999-01-06 | |||
| CN107880243A | 2018-04-06 | |||
| JP2017035802A | 2017-02-16 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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