Title:
THERMALLY CONDUCTIVE RESIN COMPOSITION, HEAT DISSIPATION SHEET, HEAT DISSIPATION MEMBER AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2018/131486
Kind Code:
A1
Abstract:
The present invention provides a thermally conductive resin composition which enables the achievement of a resin molded body that has high thermal conductivity and high flexibility. A thermally conductive resin composition which contains the components (A)-(D) described below and provides a resin molded body that has an Asker C hardness of 30 or less. (A) a two-liquid addition reaction type liquid silicone which contains an organopolysiloxane that has a vinyl group at least at an end or in a side chain and an organopolysiloxane that has two or more H-Si groups at least at an end or in a side chain, and which has a viscosity at 25°C of 100 to 2,500 mPa·s (B) 1-20% by volume of a high molecular weight silicone that has two or more vinyl groups at least at an end or in a side chain (C) 0.05-2% by volume of an alkyl alkoxy silane (D) 63-85% by volume of an inorganic filler.
Inventors:
NARA TOMOYUKI (JP)
NISHIWAKI KOHDAI (JP)
NISHIWAKI KOHDAI (JP)
Application Number:
PCT/JP2017/046935
Publication Date:
July 19, 2018
Filing Date:
December 27, 2017
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
C08L83/07; C08K5/5419; C08L83/05
Foreign References:
| JP2010260225A | 2010-11-18 | |||
| JP2000001616A | 2000-01-07 | |||
| TW500766B | 2002-09-01 | |||
| JP2009185212A | 2009-08-20 | |||
| JP2005209765A | 2005-08-04 |
Attorney, Agent or Firm:
WATANABE Kaoru (JP)
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