Title:
THERMALLY CONDUCTIVE RESIN COMPOSITION AND MOLDED ARTICLE COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2021/200711
Kind Code:
A1
Abstract:
The present invention is a polyester-elastomer-free thermally conductive resin composition containing (A) a thermoplastic resin and (B) flaky graphite, the thermally conductive resin composition having exceptional toughness and thermal conductivity, wherein: the (A) thermoplastic resin content is 45-60 parts by mass, and the B) flaky graphite content is 40-55 parts by mass (the total of (A) thermoplastic resin and (B) flaky graphite is 100 mass parts); the (B) flaky graphite contains flaky graphite (B1) in which the average particle size D50 is 150-400 μm, and flaky graphite (B2) in which the average particle size D50 is 10-40 μm, the mass ratio thereof being B1:B2=94:6-60:40; and the plane-direction thermal conductivity of a molded article obtained from the thermally conductive resin composition is 8 W/(m・K) or higher.
Inventors:
KAMIYA MOTONOBU (JP)
SHIMIZU TAKAHIRO (JP)
SHIMIZU TAKAHIRO (JP)
Application Number:
PCT/JP2021/013037
Publication Date:
October 07, 2021
Filing Date:
March 26, 2021
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
C08K7/00; C08K3/01; C08K3/04; C08L67/02; C08L101/00
Domestic Patent References:
| WO2018181146A1 | 2018-10-04 | |||
| WO2015190324A1 | 2015-12-17 |
Foreign References:
| JP2007002231A | 2007-01-11 | |||
| JP2019067687A | 2019-04-25 | |||
| JP2015030735A | 2015-02-16 | |||
| JP2009197109A | 2009-09-03 | |||
| JPH10298433A | 1998-11-10 |
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