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Title:
THERMALLY CONDUCTIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2017/002890
Kind Code:
A1
Abstract:
The present invention relates to a thermally conductive resin composition characterized by the inclusion of an (A) constituent, which is a resin whereof the melting point is 40-100°C, and a (B) constituent, which is an inorganic filler, wherein the decrease in weight of the (A) constituent is less than 10% after storage for 100 hours in air at 150°C. This thermally conductive resin composition can be used suitably, for instance, in a TIM, and particularly in a TIM for semiconductor module.

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Inventors:
ONISHI YOSHIFUMI (JP)
NISHIURA KOICHI (JP)
MIYAMOTO SHINPEI (JP)
Application Number:
PCT/JP2016/069368
Publication Date:
January 05, 2017
Filing Date:
June 30, 2016
Export Citation:
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Assignee:
KANEKA CORP (JP)
International Classes:
C08K13/02; C08K3/00; C08K5/10; C08K5/20; C08K7/00; C08L101/00; C09K5/06; H01L23/36; H01L23/373
Foreign References:
JP2008214535A2008-09-18
JP2004161885A2004-06-10
JPH03101154A1991-04-25
JPH07157750A1995-06-20
JPH0559352A1993-03-09
JP2002234952A2002-08-23
JP2013189625A2013-09-26
JP2010195960A2010-09-09
JP2006312708A2006-11-16
Other References:
See also references of EP 3318600A4
Attorney, Agent or Firm:
UEKI, Kyuichi et al. (JP)
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