THERMALLY-CONDUCTIVE RESIN COMPOSITION

WIPO Patent Application WO/2017/159689

A1

The present invention addresses the problem of providing a thermally-conductive resin composition which is highly loaded with a thermally-conductive filler, but allows for pressure-bonding and thickness-reduction, and in which degradation is almost not observed in an atmosphere at 150°C. The thermally-conductive resin composition according to the present invention contains a resin (A) having a melting point of 40-100°C, a resin (C) which is liquid at room temperature, and a thermally-conductive filler (B) which accounts for 70 vol% or more in terms of volume percentage in the composition. In the composition, a reduction in weight of the resin (A) and/or the resin (C) is preferably less than 10% when being stored in an atmosphere of 150°C for 100 hours.

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MIYAMOTO SHINPEI (JP)
ONISHI YOSHIFUMI (JP)

PCT/JP2017/010240

September 21, 2017

March 14, 2017

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KANEKA CORP (JP)

C08L101/12; C08L33/00; H01L23/36; H01L23/373; H05K7/20

JP2013179277A	2013-09-09
JP2010232535A	2010-10-14
JP2010260225A	2010-11-18
JP2000151160A	2000-05-30

SHOBAYASHI, Masayuki et al. (JP)

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