Title:
THERMALLY CONDUCTIVE RESIN MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2019/026745
Kind Code:
A1
Abstract:
A thermally conductive resin molded article including a resin and a thermally conductive filler that includes a first thermally conductive filler and a second thermally conductive filler having a smaller grain size than the first thermally conductive filler, wherein the thermally conductive filler content is 30-50% by volume, the first thermally conductive filler comprises boron nitride having a grain size of 30 μm or greater and an aspect ratio of 10 or higher, the first thermally conductive foller content is 5-20% by volume, and the second thermally conductive filler comprises a material other than boron nitride.
Inventors:
YAMAURA KOTARO (JP)
MUKAI FUMIHIRO (JP)
HOSOKAWA YUKI (JP)
MUKAI FUMIHIRO (JP)
HOSOKAWA YUKI (JP)
Application Number:
PCT/JP2018/028025
Publication Date:
February 07, 2019
Filing Date:
July 26, 2018
Export Citation:
Assignee:
BANDO CHEMICAL IND (JP)
International Classes:
C08L101/00; C08K3/22; C08K3/26; C08K3/38; H05K7/20
Domestic Patent References:
| WO2016093248A1 | 2016-06-16 | |||
| WO2015166609A1 | 2015-11-05 | |||
| WO2017135237A1 | 2017-08-10 |
Foreign References:
| JP2012229315A | 2012-11-22 | |||
| JP2013127035A | 2013-06-27 | |||
| JPH07157664A | 1995-06-20 | |||
| JP2012144626A | 2012-08-02 | |||
| JP2012229317A | 2012-11-22 | |||
| JP2013225636A | 2013-10-31 | |||
| JP2011046967A | 2011-03-10 |
Attorney, Agent or Firm:
SUNCREST PATENT AND TRADEMARK ATTORNEYS (JP)
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