Title:
THERMALLY CONDUCTIVE RESIN SHEET
Document Type and Number:
WIPO Patent Application WO/2023/063406
Kind Code:
A1
Abstract:
The present invention provides a thermally conductive resin sheet which gives such a free induction decay curve of 1H spin-spin relaxation, as determined by means of pulsed NMR, that if the free induction decay curve is separated, through curve fitting, into three curves respectively derived from three components, namely, A component, B component and C component, and lying in ascending order of relaxation time, the proportion of C component is 5% to 35%, the relaxation time of C component is 600 milliseconds or less, and the product of the proportion of C component and the relaxation time of C component is less than 5,000. The present invention is capable of providing a thermally conductive resin sheet which has high thermal conductivity, flexibility and low tack properties, while being suppressed in oil bleeding.
Inventors:
TSUCHIYA KENTO (JP)
HOSHIYAMA YUUKI (JP)
NAKAJIMA NAMI (JP)
YAHARA KAZUYUKI (JP)
HOSHIYAMA YUUKI (JP)
NAKAJIMA NAMI (JP)
YAHARA KAZUYUKI (JP)
Application Number:
PCT/JP2022/038304
Publication Date:
April 20, 2023
Filing Date:
October 14, 2022
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
H01L23/373; C08J5/18; C08K3/013; C08K3/38; C08L9/00; C08L33/00; H01L23/36
Domestic Patent References:
| WO2020045609A1 | 2020-03-05 |
Foreign References:
| JP2021004285A | 2021-01-14 | |||
| JP2021054969A | 2021-04-08 | |||
| JP2021160335A | 2021-10-11 | |||
| JP2021143297A | 2021-09-24 |
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
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