Title:
THERMALLY-CONDUCTIVE SHIELDING ORGANOSILICON MATERIAL AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2020/107599
Kind Code:
A1
Abstract:
A thermally-conductive shielding organosilicon material and a preparation method therefor. Specifically disclosed is a thermally-conductive shielding organosilicon composite film material. The thermally-conductive shielding organosilicon composite film material comprises a thermally-conductive flexible material; the thermally-conductive flexible material comprises a graphite film core material and/or a graphene film core material; the graphite film or graphene film core material is a wave-shaped or corrugation-shaped graphite film or graphene film, and the graphite film or graphene film is parallel to the extension direction of the composite film material; preferably, the thermally-conductive flexible material is a liquid silicone rubber; more preferably, the liquid silicone rubber is prepared from poly(vinylsiloxane), a crosslinking agent, a catalyst, an inhibitor, and a surface treatment agent. In the present invention, the preparation method is simple, the materials are easy to obtain, and excellent thermally-conductive and shielding effects are obtained.
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Inventors:
ZHANG BAO TAN (CN)
SUN RONG (CN)
ZHU PENG LI (CN)
SUN RONG (CN)
ZHU PENG LI (CN)
Application Number:
PCT/CN2018/123398
Publication Date:
June 04, 2020
Filing Date:
December 25, 2018
Export Citation:
Assignee:
SHENZHEN INST ADV TECH (CN)
International Classes:
C08L83/07; C08K13/02; C08L83/05
Foreign References:
| CN102538547A | 2012-07-04 | |||
| CN103895277A | 2014-07-02 | |||
| CN202074871U | 2011-12-14 | |||
| US20110014457A1 | 2011-01-20 | |||
| JP4116238B2 | 2008-07-09 | |||
| CN104981138A | 2015-10-14 | |||
| JP3515368B2 | 2004-04-05 |
Attorney, Agent or Firm:
BEIJING CHENGHUI LAW FIRM (CN)
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