THERMALLY CONDUCTIVE SILICONE ADHESIVE COMPOSITION FOR REACTOR AND REACTOR

Title:

THERMALLY CONDUCTIVE SILICONE ADHESIVE COMPOSITION FOR REACTOR AND REACTOR

Document Type and Number:

WIPO Patent Application WO/2014/185296

Kind Code:

A1

Abstract:

A thermally conductive silicone adhesive composition for a reactor, having good fluidity even when containing a large amount of thermally conductive filler to obtain a thermally conductive silicone adhesive composition, permitting potting of fine substrates, having good properties after curing, having little change in properties even with heat or moist-heat aging, and giving good adhesiveness to metals and organic resins, and a reactor potted by this composition, can be provided by making a thermally conductive silicone adhesive composition having a viscosity of 100 mPa∙s at 25°C and containing a liquid organohydrogenpolysiloxane having 2-10 hydrogen atoms bonded with silicon atoms in the molecule, containing no alkoxy groups, having at least one epoxy group bonded with a silicon atom via an alkylene group, having a polysiloxane degree of polymerization of 15 or lower, and containing a polysiloxane skeleton having a cyclic structure.

Inventors:

IWATA MITSUHIRO (JP)
KOBAYASHI MASAMI (JP)
NAKANISHI KOJI (JP)
IMANISHI HIROYUKI (JP)
YAMAZAKI HIKOHITO (JP)

Application Number:

PCT/JP2014/062169

Publication Date:

November 20, 2014

Filing Date:

May 02, 2014

Export Citation:

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Assignee:

SHINETSU CHEMICAL CO (JP)
TOYOTA MOTOR CO LTD (JP)

International Classes:

C09J183/07; C09J11/04; C09J183/04; C09J183/05; C09K3/10; C09K5/08; H01F37/00

Foreign References:

JP2012067153A	2012-04-05
JP2011122000A	2011-06-23
JP2003261769A	2003-09-19
JPS6218475A	1987-01-27
JP2009094328A	2009-04-30
JPS4732400A
JPS56100849A	1981-08-13
JPS6469661A	1989-03-15
JPH04328163A	1992-11-17
JP2000256558A	2000-09-19
JP2008239719A	2008-10-09
JP2011122000A	2011-06-23

Other References: