THERMALLY CONDUCTIVE SILICONE COMPOSITION AND ELECTRICAL/ELECTRONIC APPARATUS

Title:

THERMALLY CONDUCTIVE SILICONE COMPOSITION AND ELECTRICAL/ELECTRONIC APPARATUS

Document Type and Number:

WIPO Patent Application WO/2015/155948

Kind Code:

A1

Abstract:

Provided are: a thermally conductive silicone composition which has excellent heat resistance and thermal conductivity, in which viscosity is suppressed in an uncured state, and which has excellent handleability; and an electrical/electronic apparatus in which said thermally conductive silicone composition is used as a member. The thermally conductive silicone composition is formed by containing 100 parts by mass of: (A) either (a1) an organopolysiloxane having, in each molecule thereof, an alkoxysilyl-containing group that has at least one silicon atom bond and is represented by the general formula disclosed herein or a mixture of the (a1) component and (a2) an organopolysiloxane that has at least two alkenyl groups in each molecule thereof and does not have the alkoxysilyl-containing group {in the mixture, the content of the (a1) component is 10-100 mass% (however, 100 mass% is not included)}; and (B) 400-3500 parts by mass of a thermally conductive filler.

Inventors:

KATO TOMOKO (JP)
KODAMA HARUMI (JP)
ONISHI MASAYUKI (JP)

Application Number:

PCT/JP2015/001762

Publication Date:

October 15, 2015

Filing Date:

March 26, 2015

Export Citation:

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Assignee:

DOW CORNING TORAY CO LTD (JP)

International Classes:

C08K3/00; C08L83/14; C08L83/06; C08L83/07; H01L23/373

Foreign References:

JP2000256558A	2000-09-19
CN101775216A	2010-07-14
JP2009179714A	2009-08-13
JP2008101081A	2008-05-01
JP2010059237A	2010-03-18

Other References: