Title:
THERMALLY CONDUCTIVE SILICONE COMPOSITION AND CURED PRODUCT THEREOF, AND MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/088416
Kind Code:
A1
Abstract:
A highly thermally conductive silicone composition including: (A) an organopolysiloxane;
(B) a spherical aluminum oxide powder with an average sphericity of 0.8 or greater, 30 hydroxyl groups/nm2 or less, and an average particle diameter of 50 to 150μm; and
(C) a spherical or amorphous aluminum oxide powder with an average particle diameter of 0.1 to 5μm, wherein the mixing ratio by volume of the (B) component and the (C) component is 5:5 to 9.5:0.5, the total quantity of the (B) component and the (C) component within the composition is 80 to 90vol%, the thermal conductivity of the composition according to a hot disk method conforming to ISO 22007-2 is 5.5W/m∙K or greater, and the viscosity of the composition at 25°C is 30 to 800Pa∙s when measured with a spiral viscometer at a rotational speed of 10rpm.
Inventors:
IWATA MITSUHIRO (JP)
YAMADA KUNIHIRO (JP)
HOSODA NARIMI (JP)
YAMADA KUNIHIRO (JP)
HOSODA NARIMI (JP)
Application Number:
PCT/JP2017/040202
Publication Date:
May 17, 2018
Filing Date:
November 08, 2017
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C08L83/04; C08K3/22; C08K3/40; C08K5/541
Foreign References:
| JP2007277405A | 2007-10-25 | |||
| JP2015065330A | 2015-04-09 | |||
| JP2010013521A | 2010-01-21 | |||
| JP2016150967A | 2016-08-22 | |||
| JP2008095001A | 2008-04-24 |
Attorney, Agent or Firm:
PATENT PROFESSIONAL CORPORATION EI-MEI PATENT OFFICE (JP)
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