Title:
THERMALLY CONDUCTIVE SILICONE COMPOSITION AND CURED PRODUCT THEREOF
Document Type and Number:
WIPO Patent Application WO/2020/084868
Kind Code:
A1
Abstract:
The present invention is a thermally conductive silicone composition characterized in including: 100 parts by mass of (A) an organopolysiloxane having at least two alkenyl groups per molecule; (B) an organohydrogenpolysiloxane having at least two Si-H groups, component (B) being included in an amount such that the number of Si-H groups is 0.1-5.0 times the number of alkenyl groups derived from (A); 700-2,500 parts by mass of (C) a thermally conductive filler; and (D) a platinum group metal-based curing catalyst, component (D) being included in an amount of 0.1-2,000 ppm in terms of metal element mass relative to component (A), the thermally conductive silicone composition moreover being characterized in that component (C) is composed of 400-2,000 parts by mass of (C-1) a heavy calcium carbonate filler having an average grain size of 12-50 μm, and 0.1-1,500 parts by mass of (C-2) a heavy calcium carbonate filler having an average grain size of 0.4-10 μm. There are thereby provided: a thermally conductive silicone composition that yields a thermally conductive resin molded body having exceptional compressibility, insulating properties, thermal conductivity, and workability; and a cured product of the thermally conductive silicone composition.
Inventors:
MORIMURA TOSHIHARU (JP)
ENDO AKIHIRO (JP)
ENDO AKIHIRO (JP)
Application Number:
PCT/JP2019/030982
Publication Date:
April 30, 2020
Filing Date:
August 06, 2019
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C08L83/07; C08K3/26; C08L83/05; C08L83/06
Domestic Patent References:
| WO2018180997A1 | 2018-10-04 |
Foreign References:
| JP2014084403A | 2014-05-12 | |||
| JP2007161806A | 2007-06-28 | |||
| JP2013222836A | 2013-10-28 | |||
| JP2014105283A | 2014-06-09 |
Attorney, Agent or Firm:
YOSHIMIYA Mikio et al. (JP)
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