Title:
THERMALLY CONDUCTIVE SILICONE COMPOSITION AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2024/024498
Kind Code:
A1
Abstract:
This thermally conductive silicone composition contains: (A) an organopolysiloxane having a kinematic viscosity of 10-10,000 mm2/s; (B) an organopolysiloxane having a kinematic viscosity of 10-100,000 mm2/s; (C) an aluminum nitride powder which has an oxygen content of 0.5 mass% or less, a BET specific surface area of 1.0 m2/g or less, an average particle diameter of 3-40 μm, and a proportion of coarse particles having particle diameters of 44-105 μm in a volume-based laser diffraction type particle size distribution of 10.0 mass% or less relative to component (C) as a whole; and (D) an irregularly shaped zinc oxide powder at a quantity whereby the blending ratio of component (C) and component (D) is 5.0:5.0 to 9.5:0.5 in terms of mass ratio and the total amount of powders of components (C) and (D) is 70-85 vol% of the composition as a whole. The thermally conductive silicone composition maintains fluidity, exhibits good handleability, exhibits excellent heat dissipation performance, and exhibits excellent durability and reliability under conditions of high temperature and conditions of high temperature and high humidity.
Inventors:
IWATA MITSUHIRO (JP)
TABATA YUJI (JP)
TABATA YUJI (JP)
Application Number:
PCT/JP2023/025599
Publication Date:
February 01, 2024
Filing Date:
July 11, 2023
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C08L83/04; C08K3/22; C08K3/28; C08K5/5419; C08K9/06; C09K5/14
Domestic Patent References:
| WO2021131212A1 | 2021-07-01 | |||
| WO2020202800A1 | 2020-10-08 |
Foreign References:
| JP2009096961A | 2009-05-07 | |||
| JP2015119173A | 2015-06-25 | |||
| JP2013010862A | 2013-01-17 | |||
| JP2017043717A | 2017-03-02 | |||
| JP2013087088A | 2013-05-13 |
Attorney, Agent or Firm:
PATENT ATTORNEY CORPORATION EI-MEI PATENT OFFICE (JP)
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