Title:
THERMALLY CONDUCTIVE SILICONE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2018/025502
Kind Code:
A1
Abstract:
With respect to an addition-curable thermally conductive silicone composition in which a silver filler is blended, a catalyst having a specific structure and an organohydrogen polysiloxane having a specific structure are used for the purpose of extending the working life at room temperature, while maintaining the flexibility, so that a thermally conductive silicone composition which is able to have a good balance between flexibility after curing and storage stability in one pack, while having extremely low thermal resistance and excellent reliability is achieved.
Inventors:
TSUJI KENICHI (JP)
IWATA MITSUHIRO (JP)
AKIBA SHOTA (JP)
IWATA MITSUHIRO (JP)
AKIBA SHOTA (JP)
Application Number:
PCT/JP2017/021615
Publication Date:
February 08, 2018
Filing Date:
June 12, 2017
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C08L83/07; C08K3/08; C08L83/05
Domestic Patent References:
WO2016047219A1 | 2016-03-31 |
Foreign References:
JPH02107668A | 1990-04-19 | |||
JPH06503591A | 1994-04-21 |
Attorney, Agent or Firm:
PATENT PROFESSIONAL CORPORATION EI-MEI PATENT OFFICE (JP)
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