Title:
THERMALLY-CONDUCTIVE SILICONE GEL COMPOSITION, THERMALLY-CONDUCTIVE MEMBER, AND HEAT DISSIPATION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2019/021825
Kind Code:
A1
Abstract:
[Problem] To provide: a thermally-conductive silicone gel composition which has a high thermal conductivity, and is less likely to flow out and slip off/drop off from a surface on which the gel composition is placed, even when the composition that has not been cured is placed on a sloped surface or in a vertical direction, and has excellent gap-filling ability with respect to a heat dissipation part, etc., and excellent repairability if desired; a thermally-conductive member comprising the thermally-conductive silicone gel composition; and a heat dissipation structure using same. [Solution] Provided are: a thermally-conductive silicone gel composition containing (A) an alkenyl group-containing organopolysiloxane, (B) an organohydrogenpolysiloxane, (C) a catalyst for hydrosilylation reaction, (D) a thermally-conductive filler, (E) a silane-coupling agent, and (F) a specific organopolysiloxane having a hydrolyzable silyl group at one end thereof, wherein the gel composition has a viscosity in the range of 50-400 Pa·s at a strain rate of 10 (1/s), and the viscosity thereof at a strain rate of 1 (1/s) is 2.0 times or more of the viscosity thereof at a strain rate of 10 (1/s); and the use of the thermally-conductive silicone gel composition.
Inventors:
OTA KENJI (JP)
Application Number:
PCT/JP2018/026227
Publication Date:
January 31, 2019
Filing Date:
July 11, 2018
Export Citation:
Assignee:
DOW CORNING TORAY CO LTD (JP)
International Classes:
C08L83/07; C08K3/00; C08K5/54; C08K9/06; C08L83/05; C08L83/06; H01L23/36; H01L23/373
Foreign References:
| JP2009286855A | 2009-12-10 | |||
| JP2008239719A | 2008-10-09 | |||
| JP2017043717A | 2017-03-02 | |||
| JP2016151010A | 2016-08-22 | |||
| JP2013124257A | 2013-06-24 | |||
| JPH029618A | 1990-01-12 | |||
| JP2000001616A | 2000-01-07 | |||
| JP2005162975A | 2005-06-23 | |||
| JP2009286855A | 2009-12-10 | |||
| JP2014503680A | 2014-02-13 |
Other References:
See also references of EP 3660101A4
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