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Title:
THERMALLY CONDUCTIVE SILICONE GREASE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2019/093052
Kind Code:
A1
Abstract:
Provided is a thermally conductive silicone grease composition that comprises: (A) an organopolysiloxane having a specific kinematic viscosity; (B) an organopolysiloxane having a specific kinematic viscosity; (C) a spherical aluminum oxide powder which has a specific average sphericity, a specific number of surface hydroxyl groups, and a specific average particle size, and for which the proportion of coarse particles in a laser diffraction type particle size distribution of 25 to 45 μm is within a specific range; and (D) a spherical and/or amorphous zinc oxide powder which has a specific average particle size, and for which the proportion of coarse particles in a laser diffraction type particle size distribution of 25 to 45 μm is within a specific range. The composition has a thermal conductivity measured by the hot disk method conforming to ISO 22007-2 of 2 W/m∙K or more and less than 5.5 W/m∙K, has a coefficient of viscosity measured by a spiral viscometer at a rotation frequency of 10 rpm of 5 to 800 Pa∙s, has insulation properties and high thermal conductivity, and has excellent flowability, workability, and heat dissipation properties.

Inventors:
IWATA MITSUHIRO (JP)
Application Number:
PCT/JP2018/037726
Publication Date:
May 16, 2019
Filing Date:
October 10, 2018
Export Citation:
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Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C08L83/04; C08K3/22; C08K5/541; C08K7/16; C08L83/06; C09K5/14
Domestic Patent References:
WO2016175001A12016-11-03
Foreign References:
JP2017002179A2017-01-05
JP2016079204A2016-05-16
JP2017075282A2017-04-20
JPS5628264A1981-03-19
JPS61157587A1986-07-17
JPS5233272B21977-08-26
JPS5952195B21984-12-18
JPH02153995A1990-06-13
JPH0314873A1991-01-23
JPH10110179A1998-04-28
JP2000063872A2000-02-29
JP2002030217A2002-01-31
JP2000063873A2000-02-29
JP2004262972A2004-09-24
JP2005162975A2005-06-23
JPS4933094B11974-09-04
JPS5755977B21982-11-27
JP2002092693A2002-03-29
Other References:
See also references of EP 3708613A4
Attorney, Agent or Firm:
PATENT PROFESSIONAL CORPORATION EI-MEI PATENT OFFICE (JP)
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