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Title:
THERMALLY CONDUCTIVE SILICONE RUBBER COMPOSITE SHEET
Document Type and Number:
WIPO Patent Application WO/2018/025600
Kind Code:
A1
Abstract:
The present invention inexpensively provides a thermally conductive silicone rubber composite sheet that is advantageous for automatic mounting, the thermally conductive silicone rubber composite sheet having an excellent thermal conductivity, electrical insulation performance, strength, and flexibility, exhibiting durability due to an improved adherence between layers, and having high rigidity. The thermally conductive silicone rubber composite sheet contains a laminate structure having an intermediate layer and a pair of outer layers, which are laminated on the two sides of the intermediate layer, wherein (A) the intermediate layer is an electrically insulating synthetic resin film layer having a thermal conductivity of at least 0.20 W/m·K and a tensile modulus of elasticity of at least 5 GPa, and (B) the outer layers are a silicone rubber layer that is the cured product of a composition containing (a) an organopolysiloxane, (b) a curing agent, (c) a thermally conductive filler, and (d) a silicon compound-type adhesion-imparting agent having at least one group selected from the group consisting of an epoxy group, an alkoxy group, a methyl group, a vinyl group, and a Si-H group.

Inventors:
ENDO Akihiro (Shin-Etsu Chemical Co. Ltd., 1-10, Hitomi, Matsuida-machi, Annaka-sh, Gunma 24, 〒3790224, JP)
TANAKA Yuki (13-1, Isobe 2-chome, Annaka-sh, Gunma 27, 〒3790127, JP)
Application Number:
JP2017/025348
Publication Date:
February 08, 2018
Filing Date:
July 12, 2017
Export Citation:
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Assignee:
SHIN-ETSU CHEMICAL CO., LTD. (6-1 Ohtemachi 2-chome, Chiyoda-ku Tokyo, 04, 〒1000004, JP)
International Classes:
B32B25/20; B32B27/34; H01L23/36; H01L23/373
Attorney, Agent or Firm:
USHIKI Mamoru (3rd Fl, Yusei Fukushi Kotohira Bldg.14-1, Toranomon 1-chome, Minato-k, Tokyo 01, 〒1050001, JP)
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