Title:
THERMALLY CONDUCTIVE SILICONE RUBBER COMPOSITION, SHEET THEREOF, AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2020/129335
Kind Code:
A1
Abstract:
A thermally conductive silicone composition which includes silicones as a matrix ingredient and a thermally conductive filler, wherein the matrix ingredient comprises a silicone base polymer containing a vinyl group and a silicone oil containing no vinyl group, and the thermally conductive filler comprises aluminum nitride particles. The thermally conductive silicone composition further contains a peroxide as a curing ingredient. The thermally conductive silicone sheet 1 of the present invention is obtained by applying the thermally conductive silicone composition (3, 4) to at least one surface of a sized sheet of glass fabric 2 so as to result in a coating thickness of 0.1-1 mm. Thus, a thermally conductive silicone rubber composition and a sheet thereof which are flexible and strong and have high thermal conductivity and a method for producing the sheet are provided.
Inventors:
OGAWA TOSHIKI
Application Number:
PCT/JP2019/036279
Publication Date:
June 25, 2020
Filing Date:
September 17, 2019
Export Citation:
Assignee:
FUJI POLYMER IND (JP)
International Classes:
B32B7/027; C08L83/07; B32B17/04; B32B27/00; B32B27/20; C08K3/22; C08K3/28; C08K5/14; C08L83/05
Domestic Patent References:
| WO2017203924A1 | 2017-11-30 | |||
| WO2018074247A1 | 2018-04-26 | |||
| WO2018020862A1 | 2018-02-01 | |||
| WO2015190270A1 | 2015-12-17 |
Foreign References:
| JP2017226724A | 2017-12-28 |
Attorney, Agent or Firm:
IKEUCHI & PARTNERS (JP)
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