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Title:
THERMALLY CONDUCTIVE THIN-FILM CURED PRODUCT, METHOD FOR PRODUCING SAME, AND THERMALLY CONDUCTIVE MEMBER
Document Type and Number:
WIPO Patent Application WO/2019/142688
Kind Code:
A1
Abstract:
Provided is a thermally conductive thin-film cured product constituted by a cured product of a handleable silicone composition, the cured product having good transferability to a member and good post-debonding handling properties, and exhibiting good bond strength to a heat-generating element, even at elevated temperatures. The thermally conductive thin-film cured product is obtained by curing a silicone composition containing: (a) 100 parts by mass of an organopolysiloxane comprising two or more alkenyl groups per molecule; 200–2,000 parts by mass, inclusive, of a thermally conductive filler; (c) an amount of an organohydrodiene polysiloxane comprising two or more hydrogen atoms directly bonded to a silicon atom per molecule such that Si-H/alkenyl groups is 0.5–50.0, inclusive; (d) an amount of a platinum group metal compound equal to 0.1–1,000 ppm (mass), inclusive, with respect to component (a) in terms of the mass of the platinum group metal element; (e) a reaction regulator, as required; (f) 50–300 parts by mass, inclusive, of a silicone resin; and (g) 0.1–20 parts by mass, inclusive, of an adhesive component selected from (g-1) or (g-2).

Inventors:
ITO Takanori (Shin-Etsu Chemical Co. Ltd., 1-10, Hitomi, Matsuida-machi, Annaka-sh, Gunma 24, 〒3790224, JP)
ENDO Akihiro (Shin-Etsu Chemical Co. Ltd., 1-10, Hitomi, Matsuida-machi, Annaka-sh, Gunma 24, 〒3790224, JP)
TANAKA Yuki (13-1, Isobe 2-chome, Annaka-sh, Gunma 27, 〒3790127, JP)
Application Number:
JP2019/000139
Publication Date:
July 25, 2019
Filing Date:
January 08, 2019
Export Citation:
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Assignee:
SHIN-ETSU CHEMICAL CO., LTD. (6-1 Ohtemachi 2-chome, Chiyoda-ku Tokyo, 04, 〒1000004, JP)
International Classes:
C08G77/50; C08K3/08; C08K3/20; C08K3/28; C08K5/5425; C08L83/05; C08L83/07; C09J11/04; C09J11/06; C09J11/08; C09J183/05; C09J183/07; C09K5/14
Foreign References:
JP2009235279A2009-10-15
JP2014037507A2014-02-27
JP2015131978A2015-07-23
JPH06172653A1994-06-21
Attorney, Agent or Firm:
PATENT PROFESSIONAL CORPORATION EI-MEI PATENT OFFICE (GINZA OHTSUKA Bldg. 2F, 16-12 Ginza 2-chome, Chuo-k, Tokyo 61, 〒1040061, JP)
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