Title:
THERMALLY ENHANCED MICROCIRCUIT PACKAGE AND METHOD OF FORMING SAME
Document Type and Number:
WIPO Patent Application WO2002052644
Kind Code:
A3
Abstract:
A thermally enhanced microcircuit package includes a microcircuit having a microcircuit device cavity that receives a microcircuit device. A microelectromechanical (MEMS) cooling module is operatively connected to the microcircuit package and forms a capillary pumped loop cooling circuit having an evaporator, condenser and interconnecting cooling fluid channels for passing vapor and fluid between the evaporator and condenser and evaporating and condensing the cooling fluid.
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Inventors:
NEWTON CHARLES
RUMPF RAYMOND
GAMLEN CAROL
RUMPF RAYMOND
GAMLEN CAROL
Application Number:
PCT/US2001/045063
Publication Date:
February 27, 2003
Filing Date:
November 28, 2001
Export Citation:
Assignee:
HARRIS CORP (US)
International Classes:
B81B1/00; B81C1/00; F28D15/04; H01L23/427; (IPC1-7): H01L23/473; B81B1/00; B81B7/00
Foreign References:
| US5309457A | 1994-05-03 | |||
| US5520244A | 1996-05-28 | |||
| US5268812A | 1993-12-07 | |||
| US5801442A | 1998-09-01 |
Other References:
KIRSHBERG JEFFREY ET AL: "Demonstration of a micro-CPL based on MEMS fabrication technologies", 35TH INTESOCIETY ENERGY CONVERSION ENGINEERING CONFERENCE;LAS VEGAS, NA, USA JUL 24-JUL 28 2000, vol. 2, 2000, Proc Intersoc Energy Convers Eng Conf;Proceedings of the Intersociety Energy Conversion Engineering Conference 2000 IEEE, Piscataway, NJ, USA, pages 1198 - 1204, XP010512970
BENSON D A ET AL: "Micro-machined heat pipes in silicon MCM substrates", MULTI-CHIP MODULE CONFERENCE, 1996. MCMC-96, PROCEEDINGS., 1996 IEEE SANTA CRUZ, CA, USA 6-7 FEB. 1996, LOS ALAMITOS, CA, USA,IEEE COMPUT. SOC, US, 6 February 1996 (1996-02-06), pages 127 - 129, XP010162264, ISBN: 0-8186-7286-2
BENSON D A ET AL: "Micro-machined heat pipes in silicon MCM substrates", MULTI-CHIP MODULE CONFERENCE, 1996. MCMC-96, PROCEEDINGS., 1996 IEEE SANTA CRUZ, CA, USA 6-7 FEB. 1996, LOS ALAMITOS, CA, USA,IEEE COMPUT. SOC, US, 6 February 1996 (1996-02-06), pages 127 - 129, XP010162264, ISBN: 0-8186-7286-2
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