Title:
THERMALLY EXPANDABLE MICROCAPSULE, METHOD FOR PRODUCING THERMALLY EXPANDABLE MICROCAPSULE, FOAMABLE MASTERBATCH AND FOAM MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2011/122229
Kind Code:
A1
Abstract:
Disclosed is a thermally expandable microcapsule having superior heat resistance and durability and exhibiting superior foaming properties in a wide temperature range from low temperatures to high temperatures. Specifically disclosed is a thermally expandable microcapsule that encloses, as a core component, a volatile fluid in a shell containing a copolymer. The copolymer is obtained by polmerizing a monomer mixture containing: a monomer (A) that is at least one selected from a group formed from nitrile group-containing acrylic monomers and amide group-containing acrylic monomers; and a monomer (B) that is at least one selected from a group formed from carboxyl group-containing acrylic monomers and ester-containing acrylic monomers. The total content of the monomer (A) and monomer (B) is 70 wt% or greater of the monomer mixture, and the weight ratio of the content of the monomer (A) to the monomer (B) is 5:5 - 9:1.
More Like This:
Inventors:
MORITA Hiroyuki (2-1, Hyakuyama, Shimamotocho, Mishima-gu, Osaka 21, 〒6180021, JP)
森田 弘幸 (〒21 大阪府三島郡島本町百山２－１ 積水化学工業株式会社内 Osaka, 〒6180021, JP)
YAMAUCHI Hiroshi (2-1, Hyakuyama, Shimamotocho, Mishima-gu, Osaka 21, 〒6180021, JP)
森田 弘幸 (〒21 大阪府三島郡島本町百山２－１ 積水化学工業株式会社内 Osaka, 〒6180021, JP)
YAMAUCHI Hiroshi (2-1, Hyakuyama, Shimamotocho, Mishima-gu, Osaka 21, 〒6180021, JP)
Application Number:
JP2011/054885
Publication Date:
October 06, 2011
Filing Date:
March 03, 2011
Export Citation:
Assignee:
Sekisui Chemical Co., Ltd. (4-4 Nishitemma 2-chome, Kita-ku Osaka-sh, Osaka 65, 〒5308565, JP)
積水化学工業株式会社 (〒65 大阪府大阪市北区西天満２丁目４番４号 Osaka, 〒5308565, JP)
MORITA Hiroyuki (2-1, Hyakuyama, Shimamotocho, Mishima-gu, Osaka 21, 〒6180021, JP)
森田 弘幸 (〒21 大阪府三島郡島本町百山２－１ 積水化学工業株式会社内 Osaka, 〒6180021, JP)
積水化学工業株式会社 (〒65 大阪府大阪市北区西天満２丁目４番４号 Osaka, 〒5308565, JP)
MORITA Hiroyuki (2-1, Hyakuyama, Shimamotocho, Mishima-gu, Osaka 21, 〒6180021, JP)
森田 弘幸 (〒21 大阪府三島郡島本町百山２－１ 積水化学工業株式会社内 Osaka, 〒6180021, JP)
International Classes:
C09K3/00; B01J13/14; C08F2/44; C08F220/44
Attorney, Agent or Firm:
YASUTOMI & Associates (5-36, Miyahara 3-chome Yodogawa-k, Osaka-shi Osaka 03, 〒5320003, JP)
Download PDF:
Claims:
Previous Patent: SUBSTRATE WITH BUILT-IN SEMICONDUCTOR
Next Patent: METALLURGICAL LUBRICANT POWDER AND METAL POWDER COMPOSITION
Next Patent: METALLURGICAL LUBRICANT POWDER AND METAL POWDER COMPOSITION