THERMALLY EXPANDABLE MICROCAPSULE AND MOLDED FOAM BODY

WIPO Patent Application WO/2014/196625

A1

The present invention provides: a thermally expandable microcapsule that makes it possible to produce a molded foam body that has excellent heat resistance and a high expansion ratio, that does not easily turn yellow, and that has an excellent appearance; and a molded foam body that uses the thermally expandable microcapsule. The present invention is a thermally expandable microcapsule in which a volatile expansion agent is enclosed as a core agent in a shell that comprises a polymer. The shell comprises a polymer obtained by polymerizing a monomer composition comprising: 44-63 wt% of a polymerizable monomer (I) that is selected from at least one of acrylonitrile and methacrylonitrile; 15-30 wt% of a radical-polymerizable unsaturated carboxylic acid monomer (II) that has a carboxyl group and 3-8 carbon atoms; 0.1-3.0 wt% of a cross-linkable monomer (III) having two or more double bonds within the molecule thereof; and 21-40 wt% of a polymerizable monomer (IV) comprising at least one of a (meth)acrylic acid ester, vinylidene chloride, vinyl acetate, and a styrene-based monomer.

MATSUKUBO TATSUYA (JP)
SASAKI YUUSAKU (JP)
ITOU DAICHI (JP)
NAKANO SHINYA (JP)
KAWAGUCHI YASUHIRO (JP)

PCT/JP2014/065064

December 11, 2014

June 06, 2014

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SEKISUI CHEMICAL CO LTD (JP)

C09K3/00; B01J13/02; C08J9/32

WO2010052972A1

2010-05-14

JP2008133366A	2008-06-12
JP2009221429A	2009-10-01
JP2007314676A	2007-12-06
JP2009120660A	2009-06-04
JP2010222407A	2010-10-07

YASUTOMI & Associates (JP)
Patent business corporation Yasutomi international patent firm (JP)

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