Title:
THERMALLY-EXPANDABLE MICROSPHERES, AND COMPOSITION AND MOLDED ARTICLE CONTAINING SAME
Document Type and Number:
WIPO Patent Application WO/2016/093220
Kind Code:
A1
Abstract:
Provided are thermally-expandable microspheres having little sag. These thermally-expandable microspheres have a structure in which a blowing agent is sealed inside an outer shell formed from a polymer, wherein, if the expansion ratio is denoted as R1 after the thermally-expandable microspheres have been treated with heat for five minutes at 150°C and then foamed by heating for two minutes at 200°C, and the expansion ratio is denoted as R2 after the thermally-expandable microspheres have been treated with heat for five minutes at 150°C and then foamed by heating for four minutes at 200°C, the ratio (%) expressed by (R2/R1) × 100 is at least 105%.
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Inventors:
SUZUKI YASUHIRO (JP)
KURIU NAOKO (JP)
NOMURA SHINTARO (JP)
EJIRI TETSUO (JP)
ENDO SHUNZO (JP)
KURIU NAOKO (JP)
NOMURA SHINTARO (JP)
EJIRI TETSUO (JP)
ENDO SHUNZO (JP)
Application Number:
PCT/JP2015/084376
Publication Date:
June 16, 2016
Filing Date:
December 08, 2015
Export Citation:
Assignee:
KUREHA CORP (JP)
International Classes:
C09K3/00; B01J13/14; C08F2/44; C08F220/44; C08J9/20; C08L101/00
Domestic Patent References:
WO2006030946A1 | 2006-03-23 | |||
WO2009050863A1 | 2009-04-23 |
Other References:
See also references of EP 3231850A4
Attorney, Agent or Firm:
WATANABE KAORU (JP)
Kaoru Watanabe (JP)
Kaoru Watanabe (JP)
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