Title:
THERMALLY EXPANDABLE SHEET
Document Type and Number:
WIPO Patent Application WO/2022/244535
Kind Code:
A1
Abstract:
The present invention provides a thermally expandable sheet which sufficiently bonds two surfaces to be bonded by being thermally expanded therebetween, while being capable of suppressing the occurrence of resin flow, the two surfaces to be bonded facing each other with a space therebetween. A thermally expandable sheet which is arranged within the space that is formed between two surfaces, and which bonds the two surfaces to each other by being expanded by means of heating. This thermally expandable sheet is characterized by comprising: a base material; and a first resin layer and a second resin layer, which are adhesive layers that contain a thermosetting resin, while being formed on the base material. This thermally expandable sheet is also characterized in that: the temperature increase rate of the first resin layer is higher than the temperature increase rate of the second resin layer under specific heating conditions; and the thickness of the first resin layer is smaller than the thickness of the second resin layer before heating.
Inventors:
SHIRAIWA HIROYUKI (JP)
Application Number:
PCT/JP2022/016736
Publication Date:
November 24, 2022
Filing Date:
March 31, 2022
Export Citation:
Assignee:
NIKKAN IND (JP)
International Classes:
C09J7/35; C09J11/00; C09J163/00
Domestic Patent References:
| WO2015190235A1 | 2015-12-17 | |||
| WO2018123615A1 | 2018-07-05 |
Foreign References:
| JP2020125410A | 2020-08-20 |
Attorney, Agent or Firm:
NISHIMURA, Ryuhei (JP)
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