Title:
THERMALLY RESPONSIVE VALVE
Document Type and Number:
WIPO Patent Application WO/2023/013140
Kind Code:
A1
Abstract:
The present invention increases responsiveness of an operation of a valve body and simultaneously reduces deterioration of a diaphragm. A thermally responsive valve (100) comprises a base (81), a first diaphragm (41), a valve body (6), an expansion medium (3), and a second diaphragm (42). The first diaphragm (41) forms, together with the base (81), a storage space (83) therebetween. The valve body (6) is provided to a surface of the first diaphragm (41) on the opposite side of the storage space (83). The expansion medium (3) is stored in the storage space (83) and expands and contracts according to the temperature to deform the first diaphragm (41). The second diaphragm (42) is disposed in the storage space (83) so as to face the first diaphragm (41). An outer peripheral edge portion of the first diaphragm (41) and an outer peripheral edge portion of the second diaphragm (42) are fixed to the base (81) while being stacked on each other. In the second diaphragm (42), a communication hole (44) passing through the second diaphragm (42) in the thickness direction is formed.
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Inventors:
FUJITA TOMOYUKI (JP)
Application Number:
PCT/JP2022/012004
Publication Date:
February 09, 2023
Filing Date:
March 16, 2022
Export Citation:
Assignee:
TLV CO LTD (JP)
International Classes:
F16T1/10; F16K31/68
Domestic Patent References:
| WO2020225974A1 | 2020-11-12 |
Attorney, Agent or Firm:
TERAZONO Kenichi et al. (JP)
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