Title:
THERMALLY REVERSIBLE CROSS-LINKED HOT-MELT ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2019/082434
Kind Code:
A1
Abstract:
Provided is a thermally reversible cross-linked hot-melt adhesive which has good handling properties and storage stability, can be repeatedly melted by heating and solidified by cooling, and has high adhesiveness and good pot life. This hot-melt adhesive is obtained by melting and mixing a maleimide compound, having a maleimide group at a plurality of ends thereof, with a mixture of a star-branched-structure polyurethane resin having a furan ring at a plurality of ends thereof and a straight-chain polyurethane resin having a furan ring at both ends thereof. The hot-melt adhesive has, due to a thermally reversible equilibrium reaction, a low viscosity when being melted by heating, and, after being solidified by cooling, forms a high molecular weight body having a three-dimensionally cross-linked structure, and therefore, is a resin having high cohesive force and high adhesiveness. The hot-melt adhesive does not react with moisture in the air and therefore can be stored in air, and is particularly suitable as a hot-melt adhesive for bookbinding.
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Inventors:
KOBAYASHI KENJI (JP)
KINOSHITA NORIHIKO (JP)
KINOSHITA NORIHIKO (JP)
Application Number:
PCT/JP2018/023220
Publication Date:
May 02, 2019
Filing Date:
June 19, 2018
Export Citation:
Assignee:
TAIYO SEIKI CO (JP)
International Classes:
C09J175/06; C09J11/06
Domestic Patent References:
| WO2016157614A1 | 2016-10-06 |
Foreign References:
| JP2012530150A | 2012-11-29 | |||
| JP2003183348A | 2003-07-03 | |||
| EP3150648A1 | 2017-04-05 | |||
| JP5759987B2 | 2015-08-05 |
Attorney, Agent or Firm:
MINORI PATENT PROFESSION CORPORATION (JP)
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