THERMO-ELECTRIC COOLING SYSTEM AND METHOD FOR COOLING ELECTRONIC DEVICES

WIPO Patent Application WO/2011/083462

A3

A thermo-electric cooling (TEC) system is presented for cooling of a device, such a laser for example. The TECT system comprises first and second heat pumping assemblies, and a control unit associated at least with said second heat pumping assembly. Each heat pumping assembly has a heat source from which heat is pumped and a heat drain through which pumped heat is dissipated. The at least first and second heat pumping assemblies are arranged in a cascade relationship having at least one thermal interface between the heat source of the second heat pumping assembly and the heat drain of the first heat pumping assembly, the heat source of the first heat pumping assembly being thermally coupled to the electronic device which is to be cooled by evacuating heat therefrom. The control unit is configured and operable to carry out at least one of the following: (i) operating said second heat pumping assembly to provide a desired temperature condition such that temperature of the heat drain of said first heat pumping assembly is either desirably low or by a certain value lower than temperature of the heat source of said first heat pumping assembly; and (ii) operating said second heat pumping assembly to maintain predetermined temperature of said thermal interface.

CONNOLLY JOHN (US)
ROULSTON JOHN (GB)
MANDELIK DANIEL (IL)

PCT/IL2011/000005

October 18, 2012

January 05, 2011

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NOVATRANS GROUP SA (CH)
CONNOLLY JOHN (US)
ROULSTON JOHN (GB)
MANDELIK DANIEL (IL)

F25B21/02; H01L35/00

WO2002021609A1	2002-03-14
WO2004053370A1	2004-06-24

US20090122493A1	2009-05-14
US20090000652A1	2009-01-01

REINHOLD COHN AND PARTNERS (61131 Tel-Aviv, IL)

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