Title:
THERMOCOMPRESSION DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE USING SAME
Document Type and Number:
WIPO Patent Application WO/2022/039290
Kind Code:
A1
Abstract:
According to an embodiment, a thermocompression device for thermally compressing a semiconductor light emitting element array onto a wiring board may comprise: a lower head that supports the wiring board; an upper head that moves a donor including the semiconductor light emitting element array, and presses the semiconductor light emitting element array against a first region of the wiring board; a heating unit that heats at least one among the lower head and the upper head; a suction groove provided along an edge of the first region on the upper surface of the lower head; and a suctioning unit that communicates with the suction groove to suction the wiring board.
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Inventors:
KANG EUNJEONG (KR)
RHEE BYUNGJOON (KR)
RHEE BYUNGJOON (KR)
Application Number:
PCT/KR2020/010994
Publication Date:
February 24, 2022
Filing Date:
August 18, 2020
Export Citation:
Assignee:
LG ELECTRONICS INC (KR)
International Classes:
H01L25/075; H01L23/00; H01L23/34
Foreign References:
| KR20140025055A | 2014-03-04 | |||
| US20060087545A1 | 2006-04-27 | |||
| KR20190040493A | 2019-04-18 | |||
| KR20170140479A | 2017-12-21 | |||
| JP2018060993A | 2018-04-12 |
Attorney, Agent or Firm:
KBK & ASSOCIATES (KR)
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