Title:
THERMOCONDUCTIVE ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2013/122117
Kind Code:
A1
Abstract:
A thermoconductive adhesive sheet, wherein the quantity of organic compound gas generated by heating for 30 minutes at a temperature of 150°C does not exceed 50μg/cm2, and the thermal resistance after being stored for 30 minutes at 25°C does not exceed 10cm2⋅K/W.
Inventors:
TOJO MIDORI (JP)
TERADA YOSHIO (JP)
FURUTA KENJI (JP)
NAKAYAMA JUNICHI (JP)
TERADA YOSHIO (JP)
FURUTA KENJI (JP)
NAKAYAMA JUNICHI (JP)
Application Number:
PCT/JP2013/053437
Publication Date:
August 22, 2013
Filing Date:
February 13, 2013
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J7/10; C09J201/00; C09K5/08
Domestic Patent References:
WO2010035614A1 | 2010-04-01 |
Foreign References:
JP2007169568A | 2007-07-05 | |||
JP2011162706A | 2011-08-25 | |||
JP2011241328A | 2011-12-01 | |||
JPH111675A | 1999-01-06 | |||
JP2010047725A | 2010-03-04 | |||
JP2005179475A | 2005-07-07 | |||
JP2006089664A | 2006-04-06 | |||
JP2002322449A | 2002-11-08 | |||
JP2001279196A | 2001-10-10 | |||
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JP2012021042A | 2012-02-02 | |||
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JP2004091546A | 2004-03-25 |
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (JP)
Hiroyuki Okamoto (JP)
Hiroyuki Okamoto (JP)
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Claims: