THERMOCONDUCTIVE FILM-LIKE ADHESIVE AGENT, SEMICONDUCTOR PACKAGE, AND METHOD FOR PRODUCING SAME

WIPO Patent Application WO/2023/286389

A1

Problem: To provide a thermoconductive film-like adhesive agent that can sufficiently cause progression of a curing reaction under a milder condition, that can, when being used as a die-attach film, effectively suppress residual voids between a wiring circuit board and the adhesive agent in an obtained semiconductor package, and that can provide a semiconductor package having excellent ability to discharge heat inside the package. To also provide: a semiconductor package using said thermoconductive film-like adhesive agent; and a method for producing same.　Solution: This thermoconductive film-like adhesive agent contains an epoxy resin (A), an epoxy resin curing agent (B), a polymeric component (C), and an inorganic filler (D). The thermoconductive film-like adhesive agent has a capillary rheometer viscosity of 1-1000 Pa·s at a temperature of 120°C and a load of 20 Kg, and results in a detection time of 15 minutes or more regarding an exothermic peak in differential scanning calorimetry in which the temperature is held at 120°C.

WO/2021/065704	THERMOSETTING RESIN COMPOSITION, THERMOSETTING RESIN SHEET, ELECTRONIC COMPONENT, AND ELECTRONIC DEVICE
WO/2018/203527	ADHESIVE FILM, TAPE FOR PROCESSING SEMICONDUCTOR WAFER, SEMICONDUCTOR PACKAGE, AND PRODUCTION METHOD THEREFOR

MORITA MINORU (JP)

PCT/JP2022/015182

January 19, 2023

March 28, 2022

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FURUKAWA ELECTRIC CO LTD (JP)

C09J7/35; C09J9/02; C09J11/04; C09J163/00; H01L21/301; H01L21/52

WO2019092933A1

2019-05-16

JP6858315B1	2021-04-14
JP2016219619A	2016-12-22
JP2018041966A	2018-03-15
JP2016035066A	2016-03-17
KR20130072049A	2013-07-01

IIDA & PARTNERS et al. (JP)

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