Title:
THERMOCONDUCTIVE PUTTY COMPOSITION, AND THERMOCONDUCTIVE SHEET AND HEAT DISSIPATION STRUCTURE IN WHICH SAME IS USED
Document Type and Number:
WIPO Patent Application WO/2020/066766
Kind Code:
A1
Abstract:
This thermoconductive putty composition contains: a base polymer that includes, as a main component, a liquid polymer having a hydroxy group; and a thermoconductive filler. The thermoconductive filler content is 500-3000 parts by mass per 100 parts by mass of the base polymer.
Inventors:
ZUSHI TOSHIHIRO (JP)
ASHIDA KEIKO (JP)
NAKAHARA YU (JP)
ASHIDA KEIKO (JP)
NAKAHARA YU (JP)
Application Number:
PCT/JP2019/036468
Publication Date:
April 02, 2020
Filing Date:
September 18, 2019
Export Citation:
Assignee:
MITSUBISHI CABLE IND LTD (JP)
International Classes:
C09K5/14; H05K7/20
Foreign References:
| JP2011099003A | 2011-05-19 | |||
| JP2011157428A | 2011-08-18 | |||
| JP2008115356A | 2008-05-22 | |||
| JP2009503236A | 2009-01-29 | |||
| JP2017520633A | 2017-07-27 | |||
| JP2017530220A | 2017-10-12 | |||
| JP2017005166A | 2017-01-05 |
Attorney, Agent or Firm:
MAEDA & PARTNERS (JP)
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