Title:
THERMOCONDUCTIVE SILICONE COMPOSITION, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2019/155846
Kind Code:
A1
Abstract:
Provided is a room-temperature moisture-curable thermoconductive silicone composition that can be preserved at room temperature, and that provides a cured product exhibiting a favourable heat-dissipation effect. The thermoconductive silicone composition comprises the following components (A), (B), (C) and (D). (A) An organopolysiloxane that has a kinematic viscosity at 25°C of 10–100,000mm2 /s, and in which each of both terminals are capped with a hydroxy group. (B) A silver powder that has a tapped density of at least 3.0g/cm3, a specific surface area of no more than 2.0m2/g, and an aspect ratio of 2.0–50. (C) A silane compound having per molecule at least 3 hydrolysable groups bonded to a silicon atom; and/or a (partial) hydrolysis product of said compound, or (partial) hydrolysis condensation product of said compound. (D) A condensation catalyst. A cured product of the thermoconductive silicone composition has a ratio of thermoconductivity after heating under conditions of 150°C and pressure of 0.35MPa, to thermoconductivity before said heating, that is at least 1.5.
Inventors:
AKIBA SHOTA (JP)
Application Number:
PCT/JP2019/001373
Publication Date:
August 15, 2019
Filing Date:
January 18, 2019
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C08L83/06; C08K3/08; C08K5/541; H01L23/36; H01L23/373
Domestic Patent References:
| WO2017159252A1 | 2017-09-21 |
Foreign References:
| JP2017066406A | 2017-04-06 | |||
| JP2017165932A | 2017-09-21 | |||
| JP2018058953A | 2018-04-12 | |||
| JP2004168920A | 2004-06-17 |
Attorney, Agent or Firm:
USHIKI Mamoru (JP)
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