Title:
THERMOELECTRIC CONVERSION DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/061462
Kind Code:
A1
Abstract:
This thermoelectric conversion device (1) comprises: a substrate (11) having a first surface (11a) and a second surface (11b) opposing one another in a thickness direction; thermoelectric conversion films (12, 13) arranged on the first surface (11a); a heat-transferring part (21a) that is arranged on the first surface (11a) side and that performs heat transmission between the thermoelectric conversion films (12, 13); and a first heat-transferring member (22) arranged on the second surface (11b) side. A low thermal conduction part (20) having a thermal conductivity that is lower than the thermal conductivity of the heat-transferring part (21a) is provided in a section adjacent to the heat-transferring part (21a) in an in-plane direction of the substrate (11). The substrate (11) is joined with the first heat-transferring member (22) in a region (A1), on the second surface (11b), opposing the heat-transferring part (21a) in the thickness direction.
Inventors:
SHIBATA MAKOTO (JP)
MAEKAWA KAZUYA (JP)
ASATANI TAKASHI (JP)
MAEKAWA KAZUYA (JP)
ASATANI TAKASHI (JP)
Application Number:
PCT/JP2017/027634
Publication Date:
April 05, 2018
Filing Date:
July 31, 2017
Export Citation:
Assignee:
TDK CORP (JP)
International Classes:
H01L35/30; H01L35/32; H02N11/00
Domestic Patent References:
WO2011065185A1 | 2011-06-03 |
Foreign References:
JP2008016598A | 2008-01-24 | |||
JP2011191214A | 2011-09-29 | |||
JP2012119451A | 2012-06-21 | |||
US20150155413A1 | 2015-06-04 |
Attorney, Agent or Firm:
TANAI Sumio et al. (JP)
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