THERMOELECTRIC CONVERSION MODULE AND THERMOELECTRIC CONVERSION DEVICE

Title:

THERMOELECTRIC CONVERSION MODULE AND THERMOELECTRIC CONVERSION DEVICE

Document Type and Number:

WIPO Patent Application WO/2017/047627

Kind Code:

A1

Abstract:

A thermoelectric conversion module 1 which is obtained by connecting a plurality of thermoelectric conversion elements 3, 4 via a pair of wiring substrates 2A, 2B facing each other in such a state that the thermoelectric conversion elements 3, 4 are combined with each other between the wiring substrates 2A, 2B. Each of the wiring substrates 2A, 2B is obtained by forming an electrode layer 12, 13 on one surface of a ceramic substrate 11, said electrode layer 12, 13 being connected to the thermoelectric conversion elements 3, 4 and being formed of aluminum or an aluminum alloy. At least the electrode layer 12 that is arranged on the high-temperature side is provided with a silver base layer 21, in which a glass layer and a silver layer are laminated in the surface; and the silver layer of the silver base layer 21 is bonded to the thermoelectric conversion elements 3, 4.

Inventors:

OI SOTARO (JP)
NISHIMOTO SYUUJI (JP)
KOMASAKI MASAHITO (JP)
IWAZAKI WATARU (JP)

Application Number:

PCT/JP2016/077080

Publication Date:

March 23, 2017

Filing Date:

September 14, 2016

Export Citation:

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Assignee:

MITSUBISHI MATERIALS CORP (JP)

International Classes:

H01L35/08; H01L35/34

Domestic Patent References:

WO2009008127A1

2009-01-15

Foreign References:

US6492585B1	2002-12-10
JP2015018986A	2015-01-29
JP2009117792A	2009-05-28
JP2011198989A	2011-10-06
JP2012231024A	2012-11-22
JPH06342940A	1994-12-13
JP2006034046A	2006-02-02
JP2011061031A	2011-03-24

Other References: