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Patent Searching and Data


Title:
THERMOELECTRIC CONVERSION MODULE MEMBER, THERMOELECTRIC CONVERSION MODULE, AND METHOD FOR MANUFACTURING THERMOELECTRIC CONVERSION MODULE MEMBER
Document Type and Number:
WIPO Patent Application WO/2019/167709
Kind Code:
A1
Abstract:
Provided is a thermoelectric conversion module member in which the bonding strength between a thermoelectric conversion layer and a diffusion prevention layer is high and heat resistance is exceptional. A thermoelectric conversion module member comprising a thermoelectric conversion layer and a diffusion prevention layer that is in contact with the thermoelectric conversion layer, wherein the thermoelectric conversion layer contains a thermoelectric conversion material including elemental silicon or elemental tellurium, the diffusion prevention layer contains a metal and the same thermoelectric material as that contained in the thermoelectric conversion layer, and the amount of the thermoelectric conversion material in the diffusion prevention layer is 10-50 parts by mass in relation to 100 parts by mass of the metal.

Inventors:
DOI ATSUNORI (JP)
SHIMANO SATOSHI (JP)
Application Number:
PCT/JP2019/005974
Publication Date:
September 06, 2019
Filing Date:
February 19, 2019
Export Citation:
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Assignee:
SUMITOMO CHEMICAL CO (JP)
International Classes:
H01L35/16; H01L35/14; H01L35/32; H01L35/34; H02N11/00
Foreign References:
JP2015502043A2015-01-19
US20140096809A12014-04-10
JP2006128522A2006-05-18
Attorney, Agent or Firm:
NAKAYAMA, Tohru et al. (JP)
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