THERMOELECTRIC CONVERSION MODULE AND METHOD FOR MANUFACTURING SAME

Title:

THERMOELECTRIC CONVERSION MODULE AND METHOD FOR MANUFACTURING SAME

Document Type and Number:

WIPO Patent Application WO/2007/097059

Kind Code:

A1

Abstract:

A thermoelectric conversion module which can be miniaturized while enhancing the performance. By using the technology for producing a multilayer circuit board, especially the technology for forming a via conductor, a p-type thermoelectric semiconductor (4) and an n-type thermoelectric semiconductor (5) are formed in a laminate (3) consisting of a plurality of insulation layers (2). The p-type thermoelectric semiconductor (4) and the n-type thermoelectric semiconductor (5) are electrically connected in series through a conductor (11) for connecting between pn to constitute a pair (10) of thermoelectric conversion elements, and a plurality of pairs (10) of thermoelectric conversion element are connected in series, for example, through a series wiring conductor (12). Each thermoelectric semiconductor (4, 5) has a plurality of portions (21-23 and 24-26) having different peak temperatures of performance index, and the plurality of these portions are distributed in the laminating direction of the laminate (3).

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Inventors:

KAWAUCHI YASUHIRO (JP)
NAKAMURA TAKANORI (JP)

Application Number:

PCT/JP2006/318116

Publication Date:

August 30, 2007

Filing Date:

September 13, 2006

Export Citation:

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Assignee:

MURATA MANUFACTURING CO (JP)
KAWAUCHI YASUHIRO (JP)
NAKAMURA TAKANORI (JP)

International Classes:

H01L35/32; H01L35/26; H01L35/34

Foreign References:

JP2003092432A	2003-03-28
JP2005183593A	2005-07-07

Other References: