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Patent Searching and Data


Title:
THERMOELECTRIC CONVERSION MODULE
Document Type and Number:
WIPO Patent Application WO/2018/021173
Kind Code:
A1
Abstract:
This thermoelectric conversion module is provided with: a thermoelectric conversion element (1-1); a first substrate (1-2) which is bonded to the upper side of the thermoelectric conversion element (1-1); a second substrate (1-4) which is bonded to the lower side of the thermoelectric conversion element (1-1); and an electrode pad (1-3) which is formed on the upper surface of the first substrate (1-2). The thermoelectric conversion element (1-1) comprises: a first thermoelectric member (1-1A) which contains a first semiconductor (1-1-1); and a second thermoelectric member (1-1A) which contains a second semiconductor (1-1-1) that is electrically connected to the first semiconductor (1-1-1). The electrode pad (1-3) is electrically connected to the first semiconductor (1-1-1) or the second semiconductor (1-1-1).

Inventors:
SAITOU YUI
IKEUCHI HIROKI
MAESHIMA SATOSHI
Application Number:
PCT/JP2017/026422
Publication Date:
February 01, 2018
Filing Date:
July 21, 2017
Export Citation:
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Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
H01L35/32; F25B21/02; H02N11/00
Foreign References:
JP2011086737A2011-04-28
JP2004055994A2004-02-19
JP2013542578A2013-11-21
Attorney, Agent or Firm:
KAMATA Kenji et al. (JP)
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