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Patent Searching and Data


Title:
THERMOELECTRIC CONVERSION MODULE
Document Type and Number:
WIPO Patent Application WO/2019/188862
Kind Code:
A1
Abstract:
The present invention provides a thermoelectric conversion module which has improved adhesion between a solder layer and a thermoelectric element layer that contains a resin. This thermoelectric conversion module comprises a first substrate that has a first electrode, a second substrate that has a second electrode, a thermoelectric element layer, a solder receiving layer that is directly joined to the thermoelectric element layer, and a solder layer; and the first electrode of the first substrate and the second electrode of the second substrate are arranged to face each other. The thermoelectric element layer is composed of a thin film that is formed from a thermoelectric semiconductor composition that contains a resin; and the solder receiving layer contains a metal material.

Inventors:
KATO KUNIHISA (JP)
MUTO TSUYOSHI (JP)
KATSUTA YUMA (JP)
Application Number:
JP2019/012295
Publication Date:
October 03, 2019
Filing Date:
March 25, 2019
Export Citation:
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Assignee:
LINTEC CORP (JP)
International Classes:
H01L35/08; H01L35/16
Domestic Patent References:
WO2016104615A12016-06-30
Foreign References:
JP2001028462A2001-01-30
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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