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Patent Searching and Data

Document Type and Number:
WIPO Patent Application WO/2019/188862
Kind Code:
The present invention provides a thermoelectric conversion module which has improved adhesion between a solder layer and a thermoelectric element layer that contains a resin. This thermoelectric conversion module comprises a first substrate that has a first electrode, a second substrate that has a second electrode, a thermoelectric element layer, a solder receiving layer that is directly joined to the thermoelectric element layer, and a solder layer; and the first electrode of the first substrate and the second electrode of the second substrate are arranged to face each other. The thermoelectric element layer is composed of a thin film that is formed from a thermoelectric semiconductor composition that contains a resin; and the solder receiving layer contains a metal material.

KATO, Kunihisa (23-23 Honcho, Itabashi-k, Tokyo 01, 〒1730001, JP)
MUTO, Tsuyoshi (23-23 Honcho, Itabashi-k, Tokyo 01, 〒1730001, JP)
KATSUTA, Yuma (23-23 Honcho, Itabashi-k, Tokyo 01, 〒1730001, JP)
Application Number:
Publication Date:
October 03, 2019
Filing Date:
March 25, 2019
Export Citation:
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LINTEC CORPORATION (23-23, Honcho Itabashi-k, Tokyo 01, 〒1730001, JP)
International Classes:
H01L35/08; H01L35/16
Domestic Patent References:
Foreign References:
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (Toranomon ES Bldg. 7F, 25-2 Toranomon 3-chome, Minato-k, Tokyo 01, 〒1050001, JP)
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