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Title:
THERMOELECTRIC CONVERSION SUBSTRATE, THERMOELECTRIC CONVERSION MODULE AND METHOD FOR PRODUCING THERMOELECTRIC CONVERSION SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2017/208950
Kind Code:
A1
Abstract:
This thermoelectric conversion substrate is provided with an insulating substrate and a thermoelectric conversion unit. The insulating substrate has a first surface and a second surface on both sides in the thickness direction. The thermoelectric conversion unit is built in the insulating substrate. The thermoelectric conversion unit comprises a first thermoelectric member, a second thermoelectric member, and a first electrode that is provided on the first surface of the insulating substrate. The first thermoelectric member comprises an insulating first tubular member and a first semiconductor with which the first tubular member is filled. The second thermoelectric member comprises an insulating second tubular member and a second semiconductor which has a carrier that is different from the carrier of the first semiconductor, and with which the second tubular member is filled. The first electrode electrically connects the first semiconductor of the first thermoelectric member and the second semiconductor of the second thermoelectric member with each other.

Inventors:
AOYAMA Takuji
MAESHIMA Satoshi
SASAOKA Tatsuo
TANAKA Junya
YAMAMOTO Noboru
Application Number:
JP2017/019462
Publication Date:
December 07, 2017
Filing Date:
May 25, 2017
Export Citation:
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Assignee:
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (1-61, Shiromi 2-chome Chuo-ku, Osaka-sh, Osaka 07, 〒5406207, JP)
International Classes:
H01L35/32; F25B21/02; H01L23/36; H01L23/38; H01L35/08; H01L35/30; H01L35/34
Attorney, Agent or Firm:
KAMATA Kenji et al. (1-61, Shiromi 2-chome, Chuo-ku, Osaka-sh, Osaka 07, 〒5406207, JP)
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