Title:
THERMOELECTRIC COOLING SYSTEM
Document Type and Number:
WIPO Patent Application WO2003023294
Kind Code:
A3
Abstract:
A thermoelectric cooling system (10) includes a control unit (70) and a power source (66) providing current to an interface (18) that creates a thermal flow across a thermoelectric module having at least one heat sink (16) and at least one heat source (14). The power source (66), the interface (18), the control unit (70), and the thermoelectric module are connected to each other in series. The control unit (70) optionally includes a relay (73) and a voltage generating thermocouple (180). When voltage from the thermocouple (180) reaches a predetermined threshold, the relay (73) trips and supplies sufficient voltage to the interface to prevent thermal reversal of the heat source (14) and heat sink (16). To control moisture, a metal strap (184) may be used to restrict heat flow. Alternatively or additionally, a moisture control pad (186) may be used to absorb and re-evaporate moisture to substantially maintain a desired humidity range. In an optional embodiment, the load to be cooled may be placed below the heat source (14) and cooled by convection.
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Inventors:
BIELINSKI GEORGE
Application Number:
PCT/US2002/028346
Publication Date:
June 05, 2003
Filing Date:
September 06, 2002
Export Citation:
Assignee:
OPHIRA INC (US)
International Classes:
F24F5/00; F25B21/02; H01L35/00; H01L35/28; F25D11/00; F25D17/04; F25D31/00; (IPC1-7): F25B21/02
Foreign References:
| US5609032A | 1997-03-11 | |||
| US5554819A | 1996-09-10 | |||
| US4326383A | 1982-04-27 | |||
| US6274803B1 | 2001-08-14 |
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