THERMOELECTRIC ELEMENT-USED COOLING METHOD AND DEVICE

WIPO Patent Application WO/2004/105145

A1

A thermoelectric element-used cooling method suitable for cooling electronic members or the like, and a small cooling device using the cooling method, wherein when separated ends of an n-type semiconductor and a p-type semiconductor are respectively joined to the opposite ends of a Pt metal thin film, for example, as shown in Fig. 2(a) and Cu electrodes are respectively joined to the other ends of the n-type semiconductor and the p-type semiconductor to allow a current to flow in a direction from the n-type semiconductor to the p-type semiconductor, the n-type semiconductor-side components as a whole exhibit an endothermic action independently to effect cooling in the temperature distribution as shown. When a Cu metal thin film is used, components on both semiconductor sides cools similarly as shown in (b). When a Pb metal thin film is used, components on the p-type semiconductor are cooler than those on the the n-type semiconductor side. This action is effectively used to cool electronics elements such as semiconductor laser elements and to cool micro-scale reaction devices used for biological/chemical reactions or the like.

YABE AKIRA (JP)
OBA MASAKAZU (JP)

PCT/JP2004/006938

December 02, 2004

May 21, 2004

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NAT INST OF ADVANCED IND SCIEN (JP)
YABE AKIRA (JP)
OBA MASAKAZU (JP)

F25B21/02; H01L35/32; (IPC1-7): H01L35/32; H01L35/16; H01L23/38; F25B21/02

JPH05198847A	1993-08-06
JP2003142741A	2003-05-16
JP2003133600A	2003-05-09
JPH0425186A	1992-01-28
JPS6174379A	1986-04-16

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