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Title:
THERMOELECTRIC ELEMENT
Document Type and Number:
WIPO Patent Application WO/2022/019569
Kind Code:
A1
Abstract:
According to an embodiment, the present invention comprises: a first electrode; a first conductive bonding member disposed on the first electrode; and a plurality of semiconductor structures disposed on the first conductive bonding member, wherein the first conductive bonding member comprises first arrangement portions on which the plurality of semiconductor structure are arranged, respectively, and first barrier portions positioned between the first arrangement portions, wherein the thickness of the first barrier portions is 2.5 times or less than the thickness of the first arrangement portions.

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Inventors:
LEE JONG MIN (KR)
LEE SE WOON (KR)
CHOI MAN HUE (KR)
Application Number:
PCT/KR2021/009109
Publication Date:
January 27, 2022
Filing Date:
July 15, 2021
Export Citation:
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Assignee:
LG INNOTEK CO LTD (KR)
International Classes:
H01L35/32; H01L35/04
Foreign References:
JP2004200447A2004-07-15
KR20190116066A2019-10-14
JP2006303017A2006-11-02
JP2008277394A2008-11-13
JP2004303872A2004-10-28
Attorney, Agent or Firm:
DANA PATENT LAW FIRM (KR)
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