THERMOELECTRIC MODULE AND MANUFACTURING METHOD THEREOF

Title:

THERMOELECTRIC MODULE AND MANUFACTURING METHOD THEREOF

Document Type and Number:

WIPO Patent Application WO/2017/014584

Kind Code:

A1

Abstract:

Disclosed is a thermoelectric module which adopts a bonding technology enabling a thermoelectric module to be stably driven even at a high temperature, and a method for manufacturing the same. A thermoelectric module according to the present invention comprises: a plurality of thermoelectric elements each consisting of a thermoelectric semiconductor; an electrode which is made of a metal material and is connected between the thermoelectric elements; and a bonding layer which comprises a metal compound consisting of two or more metals, as a sintered body of a paste, interposed between the thermoelectric element and the electrode, which bonds the thermoelectric element and the electrode and comprises the two or more kinds of metal powders.

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Inventors:

LEE DAE-KI (KR)
KIM DONG-SIK (KR)
PARK YE-ROK (KR)
LEE JAE-KI (KR)
LIM BYUNG-KYU (KR)
CHOI HYUN-WOO (KR)
PARK CHEOL-HEE (KR)
LEE SEUNG-HYUP (KR)

Application Number:

PCT/KR2016/007965

Publication Date:

January 26, 2017

Filing Date:

July 21, 2016

Export Citation:

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Assignee:

LG CHEMICAL LTD (KR)

International Classes:

H01L35/34; H01L35/04; H01L35/14; H01L35/24

Foreign References:

KR20140050390A	2014-04-29
JP2015050273A	2015-03-16
KR20150065670A	2015-06-15
KR20110016113A	2011-02-17
KR20130071531A	2013-07-01

Other References: