THERMOELECTRIC MODULE AND PROCESS FOR PRODUCING THE SAME

WIPO Patent Application WO/2007/105510

A1

With respect to a thermoelectric module structured so that nearly the central part of each thermoelectric semiconductor crystal is retained by a substrate and so that both end faces of the thermoelectric semiconductor crystal are connected to electrodes, it is intended to prevent any drop of mechanical strength by soldering failure for the electrodes. There is provided a structure wherein nearly the central part of each thermoelectric semiconductor crystal (202) is retained by support substrate (201) and wherein both end faces of the thermoelectric semiconductor crystal (202) are connected to electrodes (203,204). Hot melt material sheet (205) is stuck to an upper surface of the support substrate (201) in accordance with a vacuum laminating technique, etc. In the production process, the hot melt material melted by heating attains fusion bonding of the thermoelectric semiconductor crystal (202) to the support substrate (201).

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MORINO ISAO (JP)
UECHI YASUYOSHI (JP)

PCT/JP2007/054173

September 20, 2007

March 05, 2007

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MORIX CO LTD (JP)
MORINO ISAO (JP)
UECHI YASUYOSHI (JP)

H01L35/32

JP2000286464A	2000-10-13
JP2002118297A	2002-04-19
JP2005174985A	2005-06-30
JP2005183838A	2005-07-07
JPH09181362A	1997-07-11

NEMOTO, Keiji et al. (Pros Nishi-shimbashi bldg.4F 4-3, Nishi-shimbashi 2-chome, Minato-k, Tokyo 03, JP)

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