Title:
THERMOELECTRIC MODULE
Document Type and Number:
WIPO Patent Application WO/2014/084363
Kind Code:
A1
Abstract:
This thermoelectric module is provided with: a pair of supporting substrates; wiring conductors which are respectively provided on main surfaces of the pair of supporting substrates, said main surfaces facing each other; and a thermoelectric element which is electrically connected to the wiring conductors. A sealing material is provided in the peripheral portion between the main surfaces of the pair of supporting substrates facing each other, and the sealing material has a plurality of holes inside. Since the sealing material has the holes, heat transfer from one supporting substrate to the other supporting substrate via the sealing material can be reduced.
Inventors:
AKABANE KENICHI (JP)
Application Number:
PCT/JP2013/082213
Publication Date:
June 05, 2014
Filing Date:
November 29, 2013
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01L35/32
Foreign References:
| JP2008251899A | 2008-10-16 | |||
| JP2012038980A | 2012-02-23 | |||
| JPH10303472A | 1998-11-13 | |||
| JP2007294864A | 2007-11-08 | |||
| JP2008244100A | 2008-10-09 | |||
| US20090014046A1 | 2009-01-15 | |||
| JP2003324219A | 2003-11-14 | |||
| JP2001185769A | 2001-07-06 | |||
| JP2009105305A | 2009-05-14 | |||
| JP2009206497A | 2009-09-10 | |||
| JPH11186617A | 1999-07-09 |
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