Title:
THERMOELECTRIC MODULE
Document Type and Number:
WIPO Patent Application WO/2015/045602
Kind Code:
A1
Abstract:
This thermoelectric module comprises: a first support substrate comprising a main surface that has a first region and a second region adjacent to the first region; a second support substrate provided such that the main surface thereof faces the first region; a plurality of thermoelectric elements arrayed between the first region and the main surface of the second support substrate; and a temperature detection element mounted on the second region. The temperature detection element and the second support substrate are thermally connected via a thermally conductive member.
Inventors:
AKABANE KENICHI (JP)
Application Number:
PCT/JP2014/069663
Publication Date:
April 02, 2015
Filing Date:
July 25, 2014
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01L35/32; H01L23/38; H01L23/40; H01L35/34; H02N11/00
Foreign References:
| JP2009260256A | 2009-11-05 | |||
| JPH10270762A | 1998-10-09 |
Download PDF:
Previous Patent: IMAGE DECODING DEVICE
Next Patent: CONDUCTIVE SHEET, TOUCH PANEL DEVICE, DISPLAY DEVICE, AND METHOD FOR MANUFACTURING CONDUCTIVE SHEET
Next Patent: CONDUCTIVE SHEET, TOUCH PANEL DEVICE, DISPLAY DEVICE, AND METHOD FOR MANUFACTURING CONDUCTIVE SHEET