THERMOELECTRIC MODULE - LG INNOTEK CO LTD

Title:

THERMOELECTRIC MODULE

Document Type and Number:

WIPO Patent Application WO/2019/146991

Kind Code:

A1

Abstract:

A thermoelectric module according to one embodiment of the present invention comprises: a first metal support; a first heat conductive layer arranged on the first metal support and formed from a resin composition including an epoxy resin and an inorganic filler; a second heat conductive layer arranged on the first heat conductive layer and formed from a resin composition including a silicon resin and an inorganic filler; a plurality of first electrodes arranged on the second heat conductive layer; a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs alternately arranged on the plurality of first electrodes; a plurality of second electrodes arranged on the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs; a third heat conductive layer arranged on the plurality of second electrodes, and made from the same resin composition as the resin composition that forms the first heat conductive layer; and a second metal support arranged on the third heat conductive layer, wherein the second heat conductive layer is arranged to encompass an upper surface of the first heat conductive layer and a side surface of the first heat conductive layer.

Inventors:

JO MIN SUNG (KR)
OH SUE KYUNG (KR)

Application Number:

PCT/KR2019/000894

Publication Date:

August 01, 2019

Filing Date:

January 22, 2019

Export Citation:

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Assignee:

LG INNOTEK CO LTD (KR)

International Classes:

H01L35/32; H01L35/02; H01L35/10; H01L35/22; H01L35/24

Domestic Patent References:

WO2014199541A1

2014-12-18

Foreign References:

JP2017098282A	2017-06-01
JP2006073632A	2006-03-16
JP2009105305A	2009-05-14
KR20150082914A	2015-07-16

Other References: