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Title:
THERMOEXPANDABLE REFRACTORY MATERIAL COMPOSITION, THERMOEXPANDABLE REFRACTORY MATERIAL, AND METHOD FOR PRODUCING THERMOEXPANDABLE REFRACTORY MATERIAL
Document Type and Number:
WIPO Patent Application WO/2022/097740
Kind Code:
A1
Abstract:
A thermoexpandable refractory material composition comprising an adhesive base agent and a thermoexpandable compound, wherein, at an normal temperature or at a temperature lower than an expansion initiation temperature of a thermoexpandable refractory material, the thermoexpandable refractory material composition is fluid and can be solidified or cured.

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Inventors:
MIYATA SHINGO (JP)
KINOSHITA MASAMI (JP)
IKEUCHI TAKUTO (JP)
ISHII YASUYUKI (JP)
Application Number:
PCT/JP2021/040887
Publication Date:
May 12, 2022
Filing Date:
November 05, 2021
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD (JP)
SEKISUI FULLER CO LTD (JP)
International Classes:
C09D5/18; C09D7/61; C09D201/00; C09D201/10; C09J11/04; C09J201/00; C09J201/10; C09K21/02; C09K21/04; E04B1/94
Domestic Patent References:
WO2016136896A12016-09-01
Foreign References:
JP2012214647A2012-11-08
JP2005206632A2005-08-04
JPS57145033U1982-09-11
JP2004176490A2004-06-24
JP2006231234A2006-09-07
JP2006348229A2006-12-28
JP2007113243A2007-05-10
JP2002138596A2002-05-14
JP2015530429A2015-10-15
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
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