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Patent Searching and Data


Title:
THERMOFORMING DEVICE AND THERMOFORMING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/073390
Kind Code:
A1
Abstract:
The thermoforming device according to the present invention is provided with: an upper hot plate having a first heating surface for heating a sheet from above; a lower hot plate having a second heating surface for heating the sheet from below; and a substrate supplying part having a base capable of retaining a forming substrate, the substrate supplying part being configured so as to be capable of attaching and detaching the forming substrate to and from the base and arranging the forming substrate in a forming position below the first heating surface with the sheet interposed between the first heating surface and the forming substrate; the upper hot plate and the lower hot plate being capable of heating from a top surface and a bottom surface of the sheet simultaneously, the lower hot plate being provided so as to be movable in a horizontal direction with respect to a position below the upper hot plate, and the sheet softened by being heated by the upper hot plate being die-molded with respect to the forming substrate retained on the base, or being bonded to the forming substrate.

Inventors:
TERAMOTO Kazunori (158-247, Kitayama, Morowa, Togo-cho, Aichi-gu, Aichi 51, 〒4700151, JP)
NIHIRA Masanobu (158-247, Kitayama, Morowa, Togo-cho, Aichi-gu, Aichi 51, 〒4700151, JP)
USAMI Hideki (158-247, Kitayama, Morowa, Togo-cho, Aichi-gu, Aichi 51, 〒4700151, JP)
Application Number:
JP2016/080682
Publication Date:
May 04, 2017
Filing Date:
October 17, 2016
Export Citation:
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Assignee:
ASANO LABORATORIES CO., LTD. (158-247, Kitayama Morowa, Togo-cho, Aichi-gu, Aichi 51, 〒4700151, JP)
International Classes:
B29C51/12; B29C51/10
Foreign References:
JP2015136856A2015-07-30
JPH0321426A1991-01-30
JP2011136471A2011-07-14
JPH06143329A1994-05-24
JP2007160604A2007-06-28
Attorney, Agent or Firm:
SHIGA Masatake et al. (1-9-2, Marunouchi Chiyoda-k, Tokyo 20, 〒1006620, JP)
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